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1

Noncontact RF Voltage Sensing of a Printed Trace via a Capacitive-Coupled Probe

Fang, Wenxiao, Qiu, Haimi, Luo, Chengyang, Wang, Lei, Shao, Weiheng, Shao, E., Li, Shajin, En, Yunfei

Journal:

IEEE Sensors Journal

Year:

2018

Language:

english

File:

PDF, 3.38 MB

english, 2018

2

Total-dose-induced edge effect in SOI NMOS transistors with different layouts

Jie Liu, Jicheng Zhou, Hongwei Luo, Xuedong Kong, Yunfei En, Qian Shi, Yujuan He

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 366 KB

english, 2010

3

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface

Chen, Si, Wang, Zhizhe, En, Yunfei, Huang, Yun, Qin, Fei, An, Tong

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 5.20 MB

english, 2018

4

Total-Ionizing-Dose Induced Coupling Effect in the 130-nm PDSOI I/O nMOSFETs

Chao Peng,, Zhiyuan Hu,, Bingxu Ning,, Huixiang Huang,, Zhengxuan Zhang,, Dawei Bi,, Yunfei En,, Shichang Zou,

Journal:

IEEE Electron Device Letters

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

5

[IEEE 2017 IEEE International Conference on Software Quality, Reliability and Security Companion (QRS-C) - Prague, Czech Republic (2017.7.25-2017.7.29)] 2017 IEEE International Conference on Software Quality, Reliability and Security Companion (QRS-C) - Quality Evaluation of Digital Soft IP Core for FPGA System

Lei, Dengyun, Wang, Li-wei, Lin, Jun, En, Yunfei

Year:

2017

Language:

english

File:

PDF, 174 KB

english, 2017

6

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure rate calculation for NMOS devices under multiple failure mechanisms

Zhenwei Zhou,, Xin Liu,, Qian Shi,, Yunfei En,, Xiaohan Wang,

Year:

2013

Language:

english

File:

PDF, 665 KB

english, 2013

7

SPIE Proceedings [SPIE International Conference on Optical Instruments and Technology (OIT2013) - Beijing, China (Sunday 17 November 2013)] 2013 International Conference on Optical Instruments and Technology: Optical Systems and Modern Optoelectronic Instruments - High power diode lasers reliability experiment

Wang, Yongtian, Yuan, Xiaocong, Sheng, Yunlong, Tatsuno, Kimio, Lu, Guoguang, Xie, Shaofeng, Hao, Mingming, Huang, Yun, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 440 KB

english, 2013

8

SPIE Proceedings [SPIE Photonics Asia 2010 - Beijing, China (Monday 18 October 2010)] Semiconductor Lasers and Applications IV - Lifetime estimation of high power lasers

Lu, Guoguang, Huang, Yun, En, Yunfei, Zhu, Ning-Hua, Li, Jinmin, Amzajerdian, Farzin, Suzuki, Hiroyuki

Year:

2010

Language:

english

File:

PDF, 1.47 MB

english, 2010

9

[IEEE 2000 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (23-26 Oct. 2000)] 2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515) - The different gate oxide degradation mechanism under constant voltage/current stress and ramp voltage stress

Hongwei Luo,, Yunfei En,, Xuedong Kong,, Xiaoming Zhang,

Year:

2000

Language:

english

File:

PDF, 222 KB

english, 2000

10

[IEEE 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) - Xi'an, China (2011.06.17-2011.06.19)] 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering - Aging data analysis for high power laser diodes

Lu, Guoguang, Huang, Yun, En, Yunfei

Year:

2011

Language:

english

File:

PDF, 1.10 MB

english, 2011

11

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly

Qi, Xueli, Zhou, Bin, Li, Guoyuan, Zhang, Pengfei, En, Yunfei

Year:

2011

Language:

english

File:

PDF, 2.55 MB

english, 2011

12

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - The evaluation of quality and reliability management system in the foundry process

Zhang XiaoWen,, En yunfei,

Year:

2013

Language:

english

File:

PDF, 122 KB

english, 2013

13

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Degradation characteristics and analysis of AlGaN/GaN high electron mobility transistors under reverse gate bias step stress

Chang Zeng,, Yuansheng Wang,, Xiao Hong,, Ping Lai,, Yun Huang,, Yunfei En,

Year:

2013

Language:

english

File:

PDF, 227 KB

english, 2013

14

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints

Li Xunping,, Zhou Bin,, En Yunfei,, He Xiaoqi,, Wei Xiongfeng,

Year:

2013

Language:

english

File:

PDF, 1.60 MB

english, 2013

15

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Data analysis method of the small samples and zero-failure data for space TWT accelerated life test

Song, Fangfang, Zhou, Zhenwei, Li, Shajin, En, Yunfei, Li, Bin

Year:

2014

Language:

english

File:

PDF, 397 KB

english, 2014

16

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - The irradiation effect and failure analysis of DC-DC power converter

He, Yujuan, En, Yunfei, Luo, Hongwei, He, Xiaoqi

Year:

2009

Language:

english

File:

PDF, 2.06 MB

english, 2009

17

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Critical factors on the hermetic characteristics of DC/DC power module

Li Xunping,, He Xiaoqi,, En Yunfei,, Guo Qi,

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

18

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - The relationship between LED package and reliability

Lu Guoguang,, Huang Yun,, En Yunfei,, Yang Shaohua,, Lei Zhifeng,

Year:

2009

Language:

english

File:

PDF, 6.00 MB

english, 2009

19

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Characteristic analysis of total dose irradiation annealing effect in SOI NMOSFET

He, Yujuan, Luo, Hongwei, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 411 KB

english, 2013

20

Extracting the Electromagnetic Radiated Emission Source of an Integrated Circuit by Rotating the Test Board in a TEM Cell Measurement

Fang, Wenxiao, En, Yunfei, Huang, Yun, Shao, Weiheng, Luo, Chengyang, Wang, Lei, He, Zhiyuan

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2018

Language:

english

File:

PDF, 1.49 MB

english, 2018

21

Method of Measuring the Mismatch of Parasitic Capacitance in MEMS Accelerometer Based on Regulating Electrostatic Stiffness

Dong, Xianshan, Yang, Shaohua, Zhu, Junhua, En, Yunfei, Huang, Qinwen

Journal:

Year:

2018

Language:

english

File:

PDF, 2.03 MB

english, 2018

22

Magnetic Near-field Measurement with a Differential Probe to Suppress Common Mode Noise

Shao, Weiheng, Fang, Wenxiao, Chen, Rongquan, Wang, Lei, Tian, Xinxin, He, Zhiyuan, Huang, Yun, En, Yunfei, Han, Chunyong

Journal:

IEEE Sensors Journal

Year:

2019

Language:

english

File:

PDF, 1.72 MB

english, 2019

23

A novel functional polymorphism in the Cdc6 promoter is associated with the risk for hepatocellular carcinoma

Xing-Dong Xiong, Jian-Hong Fang, Fu-En Qiu, Jing Zhao, Jiasen Cheng, Yunfei Yuan, Sheng-Ping Li, Shi-Mei Zhuang

Journal:

Mutation Research/Fundamental and Molecular Mechanisms of Mutagenesis

Year:

2008

Language:

english

File:

PDF, 352 KB

english, 2008

24

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Vibration durability modeling and dynamic response analysis of PBGA mixed solder joints

Zhou, Bin, Qiu, Baojun, En, Yunfei

Year:

2010

Language:

english

File:

PDF, 688 KB

english, 2010

25

Prediction of Safety Objective of an Enterprise Using Fuzzy Neural Network

Liu Hui, Hu Yunfei, Zhou En, Shao Kai

Journal:

Procedia Engineering

Year:

2012

Language:

english

File:

PDF, 299 KB

english, 2012

26

[IEEE 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Chengdu, China (2013.07.15-2013.07.18)] 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - End of discharge time prediction for Li-ion battery

Zhou, Zhenwei, Shi, Zhengyu, Ai, Guo, Lu, Yudong, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 402 KB

english, 2013

27

[IEEE eXpress Conference Publishing 2009 Symposium on Photonics and Optoelectronics - Wuhan, China (2009.08.14-2009.08.16)] 2009 Symposium on Photonics and Optoelectronics - Reliability of High Power QCW-AlGaAs/GaAs 808nm cm-Bars

Lu, Guoguang, Huang, Yun, En, Yunfei, Yang, Shaohua, Lei, Zhifeng

Year:

2009

Language:

english

File:

PDF, 387 KB

english, 2009

28

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Microstructural design in ultrafine interconnects under current stressing

Xiong, Hua, Huang, Zhiheng, Ren, Shan, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 1.35 MB

english, 2013

29

[IEEE 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) - Xi'an, China (2011.06.17-2011.06.19)] 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering - Effect of channel width on ESD characteristics of SOI MOS device

He, Yujuan, En, Yunfei, Luo, Hongwei, Xiao, Qingzhong

Year:

2011

Language:

english

File:

PDF, 963 KB

english, 2011

30

[IEEE 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) - Xi'an, China (2011.06.17-2011.06.19)] 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering - Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly

Qi, Xueli, Zhou, Bin, En, Yunfei

Year:

2011

Language:

english

File:

PDF, 1.05 MB

english, 2011

31

[IEEE 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) - Xi'an, China (2011.06.17-2011.06.19)] 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering - Solder joint degradation analysis using Time Domain Reflectometry

Wan, Ming, Lu, Yudong, Yao, Bin, Feng, Jingdong, En, Yunfei, Wang, Xiaohan, Wang, Xin

Year:

2011

Language:

english

File:

PDF, 905 KB

english, 2011

32

[IEEE 2006 International Workshop on Junction Technology - Shanghai, China ()] 2006 International Workshop on Junction Technology - Bias Dependence of Partially-Depleted SOI Transistor to Total Dose Irradiation

Yingmin Wang,, Xiaohe Wang,, Guiru Zhao,, Yunfei En,, Hongwei Luo,, Qian Shi,, Xiaowen Zhang,

Year:

2006

Language:

english

File:

PDF, 2.90 MB

english, 2006

33

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of gate bias on ESD characteristics in NMOS device

He, Yujuan, En, Yunfei, Luo, Hongwei, Xiao, Qingzhong

Year:

2011

Language:

english

File:

PDF, 84 KB

english, 2011

34

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Mechanisms of high power laser diode

Guoguang, Lu, Canxiong, Lai, Yun, Huang, Yunfei, En

Year:

2013

Language:

english

File:

PDF, 1020 KB

english, 2013

35

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Wang, Junde, He, Xiaoqi, Li, Xunping, En, Yunfei, Zhang, Xinping

Year:

2014

Language:

english

File:

PDF, 507 KB

english, 2014

36

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability of high power QCW cm-bar arrays

Lu Guoguang,, Huang Yun,, En Yunfei,, Yang Shaohua,, Lei Zhifeng,

Year:

2009

Language:

english

File:

PDF, 5.70 MB

english, 2009

37

[IEEE 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Chengdu, China (2013.07.15-2013.07.18)] 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - The failure mode and mechanism analysis of filament in heater of traveling wave tube

Song, Fangfang, He, Xiaoqi, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 1.73 MB

english, 2013

38

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Reliability test and analysis for vibration-induced solder joint failure of PBGA assembly

Zhou, Bin, En, Yunfei, Qi, Xueli

Year:

2011

Language:

english

File:

PDF, 726 KB

english, 2011

39

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Application of Robust Design on the Optimal Process Design of Thermo-mechanical Reliability of PBGA Solder Joint

Xiao, Xiaoqing, Zhou, Jicheng, En, Yunfei, Chen, Ni

Year:

2007

Language:

english

File:

PDF, 934 KB

english, 2007

40

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Harmonic vibration analysis and S-N curve estimate of PBGA mixed solder joints

Tao, Lu, Bin, Zhou, Kailin, Pan, Yunfei, En, Yubin, Gong

Year:

2014

Language:

english

File:

PDF, 490 KB

english, 2014

41

[IEEE 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Chengdu, China (2012.06.15-2012.06.18)] 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering - Aging data analysis methods based on short-term aging test

Lu, Guoguang, Huang, Yun, En, Yunfei

Year:

2012

Language:

english

File:

PDF, 1.32 MB

english, 2012

42

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method

Jiancheng, Weng, Ganggang, Liu, Xiaoqi, He, Bin, Zhou, Yunfei, En

Year:

2013

Language:

english

File:

PDF, 299 KB

english, 2013

43

[IEEE 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Chengdu, China (2013.07.15-2013.07.18)] 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Thermal effects in 3–5μm solid state lasers

Lu, Guoguang, Hao, Mingming, Huang, Yun, En, Yunfei

Year:

2013

Language:

english

File:

PDF, 1.50 MB

english, 2013

44

[IEEE APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) - Macao, China (2008.11.30-2008.12.3)] APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems - The irradiation effect of DC-DC power converter under X-ray

En, Yunfei, He, Yujuan, Luo, Hongwei, Shi, Qian, Kuang, Xianjun, Pan, Zhijian

Year:

2008

Language:

english

File:

PDF, 609 KB

english, 2008

45

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Burn-in Screening Technology of Power Bare Die

Huang Yun,, Yang Shaohua,, En Yunfei,, Feng Yongjie,

Year:

2010

Language:

english

File:

PDF, 636 KB

english, 2010

46

A study on the total-dose response for modified silicon-on-insulator materials with the pseudo-MOS method

Zhang, Enxia, Sun, Jiayin, Zhang, Zhengxuan, Qian, Cong, Jiang, Jun, Wang, Xi, En, Yunfei, Luo, Hongwei, Shi, Qian, Zhang, Xiaowen

Journal:

Semiconductor Science and Technology

Year:

2006

Language:

english

File:

PDF, 303 KB

english, 2006

47

A high gain wide dynamic range transimpedance amplifier for optical receivers

Liu, Lianxi, Zou, Jiao, En, Yunfei, Liu, Shubin, Niu, Yue, Zhu, Zhangming, Yang, Yintang

Journal:

Journal of Semiconductors

Year:

2014

Language:

english

File:

PDF, 465 KB

english, 2014

48

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability of indium solder die bonding of high power cm-bars

Lu Guoguang,, Huang Yun,, En Yunfei,

Year:

2010

Language:

english

File:

PDF, 802 KB

english, 2010

49

[IEEE 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Chengdu, China (2013.07.15-2013.07.18)] 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - Design of prognostic circuit for hot carrier injection failure of integrated circuit

Wang, Bin, Chen, Yiqiang, En, Yunfei, Huang, Yun, Lu, Yudong

Year:

2013

Language:

english

File:

PDF, 485 KB

english, 2013

50

[IEEE 2014 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Chengdu, China (2014.6.18-2014.6.20)] 2014 IEEE International Conference on Electron Devices and Solid-State Circuits - The Function of IR thermal imaging technology for device and circuit reliability research

Fang fang Song,, Xiaoqi He,, Yunfei En,

Year:

2014

Language:

english

File:

PDF, 301 KB

english, 2014